When soldering, what should you do when the surfaces of the connection reach adequate temperature?

When soldering, once the surfaces of the connection reach an adequate temperature, applying a proper amount of solder directly to the connection is crucial for achieving a strong and reliable bond. This action ensures that the solder flows into the joint, properly covering the surfaces being joined and allowing for the formation of a solid electrical connection.

The application of solder occurs at the right moment when both the components and the soldering iron are sufficiently heated, which promotes optimal adhesion and prevents cold solder joints. A cold joint can occur if solder is applied too early, before the materials are properly heated, leading to poor conductivity and reliability issues. Thus, applying solder at the correct time is essential to ensure a strong, well-formed joint.

Other actions, such as removing the soldering iron immediately or cooling down the joint quickly, might disrupt the soldering process or result in a weaker joint. Cleaning the area again isn't typically necessary after reaching the proper soldering temperature, as adequate preparation should have already been done. Therefore, applying the solder at the correct moment is the most effective practice in soldering.